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Thermomechanical models for leadless solder interconnections in flip chip assemblies

dc.contributor.authorVandevelde, Bart
dc.contributor.authorChristiaens, Filip
dc.contributor.authorBeyne, Eric
dc.contributor.authorRoggen, Jean
dc.contributor.authorPeeters, J.
dc.contributor.authorAllaert, K.
dc.contributor.authorVandepitte, D.
dc.contributor.authorBergmans, J.
dc.date.accessioned2021-10-01T09:31:21Z
dc.date.available2021-10-01T09:31:21Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3096
dc.sourceIIOimport
dc.titleThermomechanical models for leadless solder interconnections in flip chip assemblies
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage177
dc.source.endpage85
dc.source.journalIEEE Trans. Components, Packaging, and Manufacturing Technology. Part A
dc.source.issue1
dc.source.volume21
imec.availabilityPublished - open access


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