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Extreme thinning of Si wafers for via-last and multi wafer stacking applications

dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorRassoul, Nouredine
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorWalsby, Edward
dc.contributor.authorPatel, Jash
dc.contributor.authorAnsell, Oliver
dc.contributor.authorAshraf, Huma
dc.contributor.authorThomas, Dave
dc.contributor.authorLi, Shifang
dc.contributor.authorChang, Timothy
dc.contributor.authorHiebert, Stephen
dc.contributor.authorCross, Andrew
dc.contributor.authorStoerring, Moritz
dc.date.accessioned2021-10-25T20:29:06Z
dc.date.available2021-10-25T20:29:06Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30981
dc.sourceIIOimport
dc.titleExtreme thinning of Si wafers for via-last and multi wafer stacking applications
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorRassoul, Nouredine
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorWalsby, Edward
dc.contributor.imecauthorCross, Andrew
dc.contributor.imecauthorStoerring, Moritz
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecRassoul, Nouredine::0000-0001-9489-3396
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage8
dc.source.conferenceIEEE 68th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2018
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/abstract/document/8429745/
imec.availabilityPublished - imec


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