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IMEC N7, N5 and beyond: DTCO, STCO and EUV insertion strategy to maintain affordable scaling trend

dc.contributor.authorKim, Ryan Ryoung han
dc.contributor.authorSherazi, Yasser
dc.contributor.authorDebacker, Peter
dc.contributor.authorRaghavan, Praveen
dc.contributor.authorRyckaert, Julien
dc.contributor.authorMallik, Arindam
dc.contributor.authorVerkest, Diederik
dc.contributor.authorLee, Jae Uk
dc.contributor.authorGillijns, Werner
dc.contributor.authorTan, Ling Ee
dc.contributor.authorBlanco, Victor
dc.contributor.authorRonse, Kurt
dc.contributor.authorMcIntyre, Greg
dc.date.accessioned2021-10-25T21:02:50Z
dc.date.available2021-10-25T21:02:50Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31057
dc.sourceIIOimport
dc.titleIMEC N7, N5 and beyond: DTCO, STCO and EUV insertion strategy to maintain affordable scaling trend
dc.typeProceedings paper
dc.contributor.imecauthorKim, Ryan Ryoung han
dc.contributor.imecauthorSherazi, Yasser
dc.contributor.imecauthorDebacker, Peter
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorMallik, Arindam
dc.contributor.imecauthorVerkest, Diederik
dc.contributor.imecauthorLee, Jae Uk
dc.contributor.imecauthorGillijns, Werner
dc.contributor.imecauthorTan, Ling Ee
dc.contributor.imecauthorBlanco, Victor
dc.contributor.imecauthorRonse, Kurt
dc.contributor.orcidimecDebacker, Peter::0000-0003-3825-5554
dc.contributor.orcidimecMallik, Arindam::0000-0002-0742-9366
dc.contributor.orcidimecVerkest, Diederik::0000-0001-6567-2746
dc.contributor.orcidimecLee, Jae Uk::0000-0002-9434-5055
dc.contributor.orcidimecGillijns, Werner::0000-0002-2430-7360
dc.contributor.orcidimecTan, Ling Ee::0000-0002-3143-5176
dc.contributor.orcidimecRonse, Kurt::0000-0003-0803-4267
dc.source.peerreviewyes
dc.source.beginpage105880N
dc.source.conferenceDesign-Process-Technology Co-optimization for Manufacturability XII
dc.source.conferencedate22/02/2018
dc.source.conferencelocationSan Jose USA
dc.identifier.urlhttps://doi.org/10.1117/12.2293500
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 10588


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