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Metal-barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by surfactant residues

dc.contributor.authorKrishtab, Mikhail
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorArmini, Silvia
dc.contributor.authorWilson, Chris
dc.contributor.authorDe Gendt, Stefan
dc.date.accessioned2021-10-25T21:15:59Z
dc.date.available2021-10-25T21:15:59Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31085
dc.sourceIIOimport
dc.titleMetal-barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by surfactant residues
dc.typeMeeting abstract
dc.contributor.imecauthorKrishtab, Mikhail
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage05SALD
dc.source.conferenceMaterials for Advanced Metallization - MAM 2018
dc.source.conferencedate18/03/2018
dc.source.conferencelocationMilano Italy
dc.identifier.urlhttp://mam2018.mdm.imm.cnr.it/MAM2018.pdf
imec.availabilityPublished - open access


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