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Investigation of mechanical stress impact on microelectronic devices using a nano-indentation probing system

dc.contributor.authorLiu, Yefan
dc.contributor.authorHiblot, Gaspard
dc.contributor.authorGonzalez, Mario
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-25T22:18:22Z
dc.date.available2021-10-25T22:18:22Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31211
dc.sourceIIOimport
dc.titleInvestigation of mechanical stress impact on microelectronic devices using a nano-indentation probing system
dc.typeMeeting abstract
dc.contributor.imecauthorLiu, Yefan
dc.contributor.imecauthorHiblot, Gaspard
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecHiblot, Gaspard::0000-0002-3869-965X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.conferenceEuropean Conference on Residual Stresses - ECRS10
dc.source.conferencedate11/09/2018
dc.source.conferencelocationLeuven Belgium
dc.identifier.urlhttps://www.conftool.pro/ecrs10/sessions.php
imec.availabilityPublished - imec


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