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Study on 3D self-aligned assembly using chips with etched edge and SAM for liquid
Publication:
Study on 3D self-aligned assembly using chips with etched edge and SAM for liquid
Date
2018
Proceedings Paper
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38380.pdf
1.32 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Liu, Yong
;
Derakhshandeh, Jaber
;
Gao, Yao
;
Rebibis, Kenneth June
;
De Wolf, Ingrid
;
Li, Pei
Journal
Abstract
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1857
since deposited on 2021-10-25
Acq. date: 2025-10-28
Citations
Metrics
Views
1857
since deposited on 2021-10-25
Acq. date: 2025-10-28
Citations