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An investigation of thermo-mechanical stress in IC's induced during chip assembly

dc.contributor.authorLofrano, Melina
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCherman, Vladimir
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-25T22:24:23Z
dc.date.available2021-10-25T22:24:23Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31223
dc.sourceIIOimport
dc.titleAn investigation of thermo-mechanical stress in IC's induced during chip assembly
dc.typeMeeting abstract
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.source.peerreviewyes
dc.source.beginpage127
dc.source.endpage127
dc.source.conference10th European Conference on Residual Stresses - ECRS10
dc.source.conferencedate11/09/2018
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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