dc.contributor.author | Lofrano, Melina | |
dc.contributor.author | Gonzalez, Mario | |
dc.contributor.author | Cherman, Vladimir | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-25T22:24:23Z | |
dc.date.available | 2021-10-25T22:24:23Z | |
dc.date.issued | 2018 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/31223 | |
dc.source | IIOimport | |
dc.title | An investigation of thermo-mechanical stress in IC's induced during chip assembly | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Lofrano, Melina | |
dc.contributor.imecauthor | Gonzalez, Mario | |
dc.contributor.imecauthor | Cherman, Vladimir | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Gonzalez, Mario::0000-0003-4374-4854 | |
dc.contributor.orcidimec | Cherman, Vladimir::0000-0002-8068-9236 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 127 | |
dc.source.endpage | 127 | |
dc.source.conference | 10th European Conference on Residual Stresses - ECRS10 | |
dc.source.conferencedate | 11/09/2018 | |
dc.source.conferencelocation | Leuven Belgium | |
imec.availability | Published - imec | |