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Probing fine-pitch wafers & testing advanced packages

dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-25T22:59:04Z
dc.date.available2021-10-25T22:59:04Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31289
dc.sourceIIOimport
dc.titleProbing fine-pitch wafers & testing advanced packages
dc.typeOral presentation
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewno
dc.source.conferenceTSMC DPT Technology Symposium
dc.source.conferencedate10/05/2018
dc.source.conferencelocationHsinchu Taiwan
imec.availabilityPublished - imec


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