Probing fine-pitch wafers & testing advanced packages
dc.contributor.author | Marinissen, Erik Jan | |
dc.date.accessioned | 2021-10-25T22:59:04Z | |
dc.date.available | 2021-10-25T22:59:04Z | |
dc.date.issued | 2018 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/31289 | |
dc.source | IIOimport | |
dc.title | Probing fine-pitch wafers & testing advanced packages | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Marinissen, Erik Jan | |
dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
dc.source.peerreview | no | |
dc.source.conference | TSMC DPT Technology Symposium | |
dc.source.conferencedate | 10/05/2018 | |
dc.source.conferencelocation | Hsinchu Taiwan | |
imec.availability | Published - imec |
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