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Low cost high density multilayer interconnection technology

dc.contributor.authorVrana, M.
dc.contributor.authorDe Baets, J.
dc.contributor.authorVan Calster, Andre
dc.contributor.authorBorn, Ivan
dc.contributor.authorDetemmerman, Danny
dc.date.accessioned2021-10-01T09:42:36Z
dc.date.available2021-10-01T09:42:36Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3136
dc.sourceIIOimport
dc.titleLow cost high density multilayer interconnection technology
dc.typeProceedings paper
dc.contributor.imecauthorVan Calster, Andre
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage129
dc.source.endpage133
dc.source.conferenceProceedings of the 3rd European Conference on Electronic Packaging Technology and 9th International Conference on Interconnectio
dc.source.conferencedate15/06/1998
dc.source.conferencelocationNuremberg Germany
imec.availabilityPublished - open access
imec.internalnotesDVS Berichte; Vol. 191


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