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Thermal budget limitations when integrating a low-k hydrogen silsesquioxane interconnect technology

dc.contributor.authorWaeterloos, Joost
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-01T09:43:27Z
dc.date.available2021-10-01T09:43:27Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3139
dc.sourceIIOimport
dc.titleThermal budget limitations when integrating a low-k hydrogen silsesquioxane interconnect technology
dc.typeProceedings paper
dc.contributor.imecauthorMaex, Karen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage343
dc.source.endpage345
dc.source.conferenceAdvanced Metallization and Interconnect Systems for ULSI Applications in 1997
dc.source.conferencedate30/09/1997
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access
imec.internalnotesMRS Conference Proceedings; Vol. ULSI XII


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