Authors

Nivelle, Philippe; Borgers, Tom; Voroshazi, Eszter; Poortmans, Jef; D'Haen, Jan; De Ceuninck, Ward; Daenen, Michaël

Conference

IEEE International Reliability Physics Symposium - IRPS

Title

Mechanical and chemical adhesion at the encapsulant interfaces during the lamination of photovoltaic modules

Publication type

Proceedings paper

Embargo date

9999-12-31