Show simple item record

Thermal performance comparison of advanced 3D packages for mobile applications

dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-26T00:27:55Z
dc.date.available2021-10-26T00:27:55Z
dc.date.issued2018-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31452
dc.sourceIIOimport
dc.titleThermal performance comparison of advanced 3D packages for mobile applications
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage318
dc.source.endpage324
dc.source.conferenceIEEE Itherm Conference
dc.source.conferencedate29/05/2018
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record