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A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch

dc.contributor.authorPodpod, Arnita
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorDuval, Fabrice
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorGonzalez, Mario
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-26T01:24:18Z
dc.date.available2021-10-26T01:24:18Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31548
dc.sourceIIOimport
dc.titleA novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch
dc.typeProceedings paper
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.source.peerreviewyes
dc.source.beginpage370
dc.source.endpage378
dc.source.conference68th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2018
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/abstract/document/8429576/
imec.availabilityPublished - imec


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