Show simple item record

Additives in Cu plating for microelectronics applications

dc.contributor.authorRadisic, Alex
dc.contributor.authorRoss, Frances
dc.contributor.authorHaesevoets, Karel
dc.contributor.authorStruyf, Herbert
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-26T01:48:02Z
dc.date.available2021-10-26T01:48:02Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31587
dc.sourceIIOimport
dc.titleAdditives in Cu plating for microelectronics applications
dc.typeMeeting abstract
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorHaesevoets, Karel
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewyes
dc.source.beginpage1251
dc.source.conference233rd Electrochemical Society Meeting
dc.source.conferencedate13/05/2018
dc.source.conferencelocationSeattle, WA USA
dc.identifier.urlhttp://ma.ecsdl.org/content/MA2018-01/19/1251
imec.availabilityPublished - imec
imec.internalnotesECS Meeting Abstracts; Vol. MA2018-01


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record