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Study of the influence of material properties and geometric parameters on warpage for Fan-Out Wafer Level Packaging

dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorGonzalez, Mario
dc.contributor.authorPodpod, Arnita
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-26T03:08:19Z
dc.date.available2021-10-26T03:08:19Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31712
dc.sourceIIOimport
dc.titleStudy of the influence of material properties and geometric parameters on warpage for Fan-Out Wafer Level Packaging
dc.typeProceedings paper
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage6
dc.source.conference7th Electronic System-Integration Technology Conference - ESTC
dc.source.conferencedate18/09/2018
dc.source.conferencelocationDresden Germany
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8546433
imec.availabilityPublished - open access


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