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Novel failure analysis techniques for 1.8 μm pitch wafer-to-wafer bonding

dc.contributor.authorSchmidt, Christian
dc.contributor.authorLechner, Lorenz
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-26T03:25:55Z
dc.date.available2021-10-26T03:25:55Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31738
dc.sourceIIOimport
dc.titleNovel failure analysis techniques for 1.8 μm pitch wafer-to-wafer bonding
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage92
dc.source.endpage96
dc.source.conferenceIEEE 68th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2018
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/abstract/document/8429535
imec.availabilityPublished - imec


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