dc.contributor.author | Simoen, Eddy | |
dc.contributor.author | Hsu, Brent | |
dc.contributor.author | He, Liang | |
dc.contributor.author | Mols, Yves | |
dc.contributor.author | Kunert, Bernardette | |
dc.contributor.author | Langer, Robert | |
dc.contributor.author | Waldron, Niamh | |
dc.contributor.author | Eneman, Geert | |
dc.contributor.author | Collaert, Nadine | |
dc.contributor.author | Heyns, Marc | |
dc.contributor.author | Claeys, Cor | |
dc.date.accessioned | 2021-10-26T03:56:06Z | |
dc.date.available | 2021-10-26T03:56:06Z | |
dc.date.issued | 2018 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/31786 | |
dc.source | IIOimport | |
dc.title | Do we have to worry about extended defects in high-mobility materials? | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Simoen, Eddy | |
dc.contributor.imecauthor | Hsu, Brent | |
dc.contributor.imecauthor | Mols, Yves | |
dc.contributor.imecauthor | Kunert, Bernardette | |
dc.contributor.imecauthor | Langer, Robert | |
dc.contributor.imecauthor | Waldron, Niamh | |
dc.contributor.imecauthor | Eneman, Geert | |
dc.contributor.imecauthor | Collaert, Nadine | |
dc.contributor.imecauthor | Heyns, Marc | |
dc.contributor.orcidimec | Simoen, Eddy::0000-0002-5218-4046 | |
dc.contributor.orcidimec | Hsu, Brent::0000-0003-0823-6088 | |
dc.contributor.orcidimec | Kunert, Bernardette::0000-0002-8986-4109 | |
dc.contributor.orcidimec | Langer, Robert::0000-0002-1132-3468 | |
dc.contributor.orcidimec | Eneman, Geert::0000-0002-5849-3384 | |
dc.contributor.orcidimec | Collaert, Nadine::0000-0002-8062-3165 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.conference | China Semiconductor Technology International Conference - CSTIC | |
dc.source.conferencedate | 11/03/2018 | |
dc.source.conferencelocation | Shanghai China | |
dc.identifier.url | https://ieeexplore.ieee.org/document/8369190/?tp=&arnumber=8369190 | |
imec.availability | Published - open access | |