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Modeling and Characterization of TSV-Induced Noise Coupling

dc.contributor.authorSun, Xiao
dc.contributor.authorRack, Martin
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorRaskin, Jean-Pierre
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-26T04:59:26Z
dc.date.available2021-10-26T04:59:26Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31883
dc.sourceIIOimport
dc.titleModeling and Characterization of TSV-Induced Noise Coupling
dc.typeBook chapter
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpageChapter 7
dc.source.bookNoise Coupling in System-on-Chip
dc.identifier.urlhttps://www.crcpress.com/Noise-Coupling-in-System-on-Chip/Noulis/p/book/9781498796774
imec.availabilityPublished - imec
imec.internalnotesISBN 9781498796774


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