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Plastic QFN packaging for space applications

dc.contributor.authorvan Dommelen, Ignas
dc.contributor.authorBonnet, Barbara
dc.contributor.authorFeron, Marc
dc.contributor.authorCherman, Vladimir
dc.contributor.authorAguinaga, Daniel
dc.contributor.authorGonzalez, Mario
dc.date.accessioned2021-10-26T06:46:15Z
dc.date.available2021-10-26T06:46:15Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32044
dc.sourceIIOimport
dc.titlePlastic QFN packaging for space applications
dc.typeProceedings paper
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorGonzalez, Mario
dc.source.peerreviewyes
dc.source.beginpage29
dc.source.endpage34
dc.source.conference2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
dc.source.conferencedate12/06/2018
dc.source.conferencelocationOulu Finland
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8423851/
imec.availabilityPublished - imec


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