dc.contributor.author | Van Dyck, Rik | |
dc.contributor.author | Borgers, Tom | |
dc.contributor.author | Govaerts, Jonathan | |
dc.contributor.author | Nivelle, Philippe | |
dc.contributor.author | van der Heide, Arvid | |
dc.contributor.author | De Jonge, S. | |
dc.contributor.author | Voroshazi, Eszter | |
dc.contributor.author | Szlufcik, Jozef | |
dc.contributor.author | Van Vuure, A.W. | |
dc.contributor.author | Poortmans, Jef | |
dc.date.accessioned | 2021-10-26T06:48:39Z | |
dc.date.available | 2021-10-26T06:48:39Z | |
dc.date.issued | 2018 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/32047 | |
dc.source | IIOimport | |
dc.title | Multi-wire interconnection: The impact of the lamination process and the encapsulant properties on the solder joint formation | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Van Dyck, Rik | |
dc.contributor.imecauthor | Borgers, Tom | |
dc.contributor.imecauthor | Govaerts, Jonathan | |
dc.contributor.imecauthor | Nivelle, Philippe | |
dc.contributor.imecauthor | van der Heide, Arvid | |
dc.contributor.imecauthor | Voroshazi, Eszter | |
dc.contributor.imecauthor | Szlufcik, Jozef | |
dc.contributor.imecauthor | Poortmans, Jef | |
dc.contributor.orcidimec | Van Dyck, Rik::0000-0003-3947-4361 | |
dc.contributor.orcidimec | Borgers, Tom::0000-0002-7878-6977 | |
dc.contributor.orcidimec | Govaerts, Jonathan::0000-0002-8908-1198 | |
dc.contributor.orcidimec | van der Heide, Arvid::0000-0002-7589-4526 | |
dc.contributor.orcidimec | Poortmans, Jef::0000-0003-2077-2545 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1328 | |
dc.source.endpage | 1332 | |
dc.source.conference | 35th European Photovoltaic Solar Energy Conference and Exhibition - EUPVSEC | |
dc.source.conferencedate | 24/09/2018 | |
dc.source.conferencelocation | Brussels Belgium | |
dc.identifier.url | https://www.eupvsec-proceedings.com/proceedings?fulltext=imec&paper=45015 | |
imec.availability | Published - imec | |