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Process integration induced thermodesorption from SiO2/SiLK resin dielectric based interconnects

dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorMuroyama, M.
dc.contributor.authorJudelewicz, Moshe
dc.contributor.authorKondoh, Eiichi
dc.contributor.authorLi, H.
dc.contributor.authorWaeterloos, Joost
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-06T10:41:37Z
dc.date.available2021-10-06T10:41:37Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3209
dc.sourceIIOimport
dc.titleProcess integration induced thermodesorption from SiO2/SiLK resin dielectric based interconnects
dc.typeJournal article
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewno
dc.source.beginpage2136
dc.source.endpage2146
dc.source.journalJ. Vacuum Science and Technology B
dc.source.issue5
dc.source.volume17
imec.availabilityPublished - imec


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