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Impact of Back-End-Of-Line architecture on Chip-Package-Interaction in advanced interconnects using shear microprobing and finite element simulations

dc.contributor.authorVanstreels, Kris
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorGonzalez, Mario
dc.date.accessioned2021-10-26T08:04:34Z
dc.date.available2021-10-26T08:04:34Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32157
dc.sourceIIOimport
dc.titleImpact of Back-End-Of-Line architecture on Chip-Package-Interaction in advanced interconnects using shear microprobing and finite element simulations
dc.typeMeeting abstract
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage023DI
dc.source.conferenceMaterials for Advanced Metallization - MAM 2018
dc.source.conferencedate18/03/2018
dc.source.conferencelocationMilano Italy
dc.identifier.urlhttp://mam2018.mdm.imm.cnr.it/MAM2018.pdf
imec.availabilityPublished - open access


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