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Electromigration and thermal storage study of barrierless Co vias

dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorCroes, Kristof
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorDictus, Dries
dc.contributor.authorZhao, Larry
dc.contributor.authorKolics, Artur
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-26T08:06:00Z
dc.date.available2021-10-26T08:06:00Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32159
dc.sourceIIOimport
dc.titleElectromigration and thermal storage study of barrierless Co vias
dc.typeProceedings paper
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorDictus, Dries
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecDictus, Dries::0000-0002-7896-1747
dc.source.peerreviewyes
dc.source.beginpage48
dc.source.endpage50
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2018
dc.source.conferencelocationSanta Clara, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8430396
imec.availabilityPublished - imec


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