Show simple item record

Flip-chip redistribution using stencilprinted bumps

dc.contributor.authorBeerten, Steven
dc.contributor.authorBeyne, Eric
dc.contributor.authorHonoré, Mia
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorWojciechowski, Dominique
dc.contributor.authorTruzzi, Claudio
dc.date.accessioned2021-10-06T10:42:07Z
dc.date.available2021-10-06T10:42:07Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3220
dc.sourceIIOimport
dc.titleFlip-chip redistribution using stencilprinted bumps
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceArea Array Packaging Technologies Workshop
dc.source.conferencedate15/11/1999
dc.source.conferencelocationBerlin Germany
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
3182.pdf
Size:
713.3Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record