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3D printed liquid jet impingement cooler: Demonstration, opportunities and challenges

dc.contributor.authorWei, Tiwei
dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.authorYang, Shoufeng
dc.contributor.authorBaelmans, Martine
dc.date.accessioned2021-10-26T09:17:50Z
dc.date.available2021-10-26T09:17:50Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32257
dc.sourceIIOimport
dc.title3D printed liquid jet impingement cooler: Demonstration, opportunities and challenges
dc.typeProceedings paper
dc.contributor.imecauthorWei, Tiwei
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage2383
dc.source.endpage2390
dc.source.conferenceIEEE 68th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2018
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8429873/
imec.availabilityPublished - imec


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