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300 mm wafer development for pattern collapse evaluations

dc.contributor.authorXu, XiuMei
dc.contributor.authorTao, Zheng
dc.contributor.authorSaib, Mohamed
dc.contributor.authorSebaai, Farid
dc.contributor.authorVan de Kerkhove, Jeroen
dc.contributor.authorVrancken, Nandi
dc.contributor.authorVereecke, Guy
dc.contributor.authorHolsteyns, Frank
dc.date.accessioned2021-10-26T09:59:46Z
dc.date.available2021-10-26T09:59:46Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32314
dc.sourceIIOimport
dc.title300 mm wafer development for pattern collapse evaluations
dc.typeProceedings paper
dc.contributor.imecauthorXu, XiuMei
dc.contributor.imecauthorTao, Zheng
dc.contributor.imecauthorSaib, Mohamed
dc.contributor.imecauthorSebaai, Farid
dc.contributor.imecauthorVan de Kerkhove, Jeroen
dc.contributor.imecauthorVrancken, Nandi
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecXu, XiuMei::0000-0002-3356-8693
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.source.peerreviewyes
dc.source.beginpage207
dc.source.endpage210
dc.source.conferenceUltra Clean Processing of Semiconductor Surfaces XIV - UCPSS
dc.source.conferencedate3/09/2018
dc.source.conferencelocationLeuven Belgium
dc.identifier.urlhttps://www.scientific.net/SSP.282.207
imec.availabilityPublished - imec
imec.internalnotesSolid State Phenomena; Vol. 282


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