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Trends in packaging and high density interconnection

dc.contributor.authorBeyne, Eric
dc.contributor.authorMertens, Robert
dc.date.accessioned2021-10-06T10:42:46Z
dc.date.available2021-10-06T10:42:46Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3232
dc.sourceIIOimport
dc.titleTrends in packaging and high density interconnection
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorMertens, Robert
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage11
dc.source.endpage15
dc.source.conference11th International Conference on Microelectronics - ICM
dc.source.conferencedate22/11/1999
dc.source.conferencelocationSafat Kuwait
imec.availabilityPublished - imec


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