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dc.contributor.authorZhang, Lei
dc.contributor.authorJones, Ben
dc.contributor.authorBuja, Federico
dc.contributor.authorCherman, Vladimir
dc.contributor.authorOprins, Herman
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-26T10:41:20Z
dc.date.available2021-10-26T10:41:20Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32371
dc.sourceIIOimport
dc.titleHigh heat flux removal using optimized microchannel heat sink
dc.typeProceedings paper
dc.contributor.imecauthorZhang, Lei
dc.contributor.imecauthorJones, Ben
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage6
dc.source.conference24rd International Workshop on Thermal Investigations of ICs and Systems - THERMINIC
dc.source.conferencedate26/09/2018
dc.source.conferencelocationStockholm Sweden
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8593328
imec.availabilityPublished - open access


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