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Studying the effects of chemistry and geometry on DSA hole-shrink process in three dimensions

dc.contributor.authorZhou, Chun
dc.contributor.authorKurosawa, Tsuyoshi
dc.contributor.authorDazai, Takahiro
dc.contributor.authorDoise, Jan
dc.contributor.authorRen, Jiaxing
dc.contributor.authorBezik, Cody
dc.contributor.authorSagal-Peretz, Tamar
dc.contributor.authorYamazaki, Akioshi
dc.contributor.authorGronheid, Roel
dc.contributor.authorRincon Delgadillo, Paulina
dc.contributor.authorde Pablo, Juan
dc.contributor.authorNealey, Paul S.
dc.date.accessioned2021-10-26T10:48:51Z
dc.date.available2021-10-26T10:48:51Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32381
dc.sourceIIOimport
dc.titleStudying the effects of chemistry and geometry on DSA hole-shrink process in three dimensions
dc.typeProceedings paper
dc.contributor.imecauthorDoise, Jan
dc.contributor.imecauthorGronheid, Roel
dc.contributor.imecauthorRincon Delgadillo, Paulina
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage105840K
dc.source.conferenceNovel Patterning Technologies 2018
dc.source.conferencedate25/02/2018
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttps://doi.org/10.1117/12.2297461
imec.availabilityPublished - open access
imec.internalnotesProceedings of SPIE; Vol. 10584


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