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Studying the effects of chemistry and geometry on DSA hole-shrink process in three-dimensions

dc.contributor.authorZhou, Chun
dc.contributor.authorKurosawa, Tsuyoshi
dc.contributor.authorDazai, Takahiro
dc.contributor.authorDoise, Jan
dc.contributor.authorRen, Jiaxing
dc.contributor.authorBezik, Cody
dc.contributor.authorSegal-Peretz, Tamar
dc.contributor.authorGronheid, Roel
dc.contributor.authorRincon Delgadillo, Paulina
dc.contributor.authorYamazaki,, Akiyoshi
dc.contributor.authorde Pablo, Juan
dc.contributor.authorNealey, Paul
dc.date.accessioned2021-10-26T10:49:40Z
dc.date.available2021-10-26T10:49:40Z
dc.date.issued2018
dc.identifier.issn1932-5150
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32382
dc.sourceIIOimport
dc.titleStudying the effects of chemistry and geometry on DSA hole-shrink process in three-dimensions
dc.typeJournal article
dc.contributor.imecauthorDoise, Jan
dc.contributor.imecauthorGronheid, Roel
dc.contributor.imecauthorRincon Delgadillo, Paulina
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage31203
dc.source.journalJournal of Micro/Nanolithography MEMS and MOEMS
dc.source.issue3
dc.source.volume17
dc.identifier.urlhttps://doi.org/10.1117/1.JMM.17.3.031203
imec.availabilityPublished - open access


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