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Studying the effects of chemistry and geometry on DSA hole-shrink process in three-dimensions
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Studying the effects of chemistry and geometry on DSA hole-shrink process in three-dimensions
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Date
2018
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Zhou, Chun
;
Kurosawa, Tsuyoshi
;
Dazai, Takahiro
;
Doise, Jan
;
Ren, Jiaxing
;
Bezik, Cody
;
Segal-Peretz, Tamar
;
Gronheid, Roel
;
Rincon Delgadillo, Paulina
;
Yamazaki,, Akiyoshi
;
de Pablo, Juan
;
Nealey, Paul
Journal
Journal of Micro/Nanolithography MEMS and MOEMS
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1902
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Acq. date: 2025-12-11
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Metrics
Views
1902
since deposited on 2021-10-26
3
last month
1
last week
Acq. date: 2025-12-11
Citations