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Effect of overmolding process on the integrity of electronic circuits

dc.contributor.authorBakr, Mona
dc.contributor.authorSu, Yibo
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-27T07:28:41Z
dc.date.available2021-10-27T07:28:41Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32480
dc.sourceIIOimport
dc.titleEffect of overmolding process on the integrity of electronic circuits
dc.typeProceedings paper
dc.contributor.imecauthorBakr, Mona
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conference22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
dc.source.conferencedate16/09/2019
dc.source.conferencelocationPisa Italy
imec.availabilityPublished - open access


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