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Assessment of Electromigration in Nano-Interconnects

dc.contributor.authorCeric, Hajdin
dc.contributor.authorSelberherr, Siegfried
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorde Orio, Roberto
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-27T07:55:16Z
dc.date.available2021-10-27T07:55:16Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32672
dc.sourceIIOimport
dc.titleAssessment of Electromigration in Nano-Interconnects
dc.typeProceedings paper
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conference16th International Conference on Reliability and Stress-related Phenomena in Nano and Microelectronics - IRSP
dc.source.conferencedate4/11/2019
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttps://www.irspconference.com/schedule-and-spreakers
imec.availabilityPublished - open access


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