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Advanced modeling and simulation of Cu nano-interconnects reliability

dc.contributor.authorCeric, Hajdin
dc.contributor.authorZahedmanesh, Houman
dc.date.accessioned2021-10-27T07:55:26Z
dc.date.available2021-10-27T07:55:26Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32673
dc.sourceIIOimport
dc.titleAdvanced modeling and simulation of Cu nano-interconnects reliability
dc.typeProceedings paper
dc.contributor.imecauthorZahedmanesh, Houman
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage4.03
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019)
dc.source.conferencedate3/06/2019
dc.source.conferencelocationBrussels Belgium
dc.identifier.urlhttps://iitc-conference.org/2019-iitc-mam-program/
imec.availabilityPublished - open access


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