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Analysis of electromigration failure of nano-interconnects through a combination of modeling and experimental methods

dc.contributor.authorCeric, Hajdin
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-27T07:55:37Z
dc.date.available2021-10-27T07:55:37Z
dc.date.issued2019
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32674
dc.sourceIIOimport
dc.titleAnalysis of electromigration failure of nano-interconnects through a combination of modeling and experimental methods
dc.typeJournal article
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage113362
dc.source.journalMicroelectronics Reliability
dc.source.volume100-101
dc.identifier.urlhttps://doi.org/10.1016/j.microrel.2019.06.054
imec.availabilityPublished - imec
imec.internalnotesPaper from special issue ESREF 2019


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