Show simple item record

High spatial resolution measurements of thermo-mechanical stress effects in flip-chip package

dc.contributor.authorCherman, Vladimir
dc.contributor.authorLofrano, Melina
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T08:01:18Z
dc.date.available2021-10-27T08:01:18Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32702
dc.sourceIIOimport
dc.titleHigh spatial resolution measurements of thermo-mechanical stress effects in flip-chip package
dc.typeProceedings paper
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conferenceEuropean Microelectronics and Packaging Conference (EMPC)
dc.source.conferencedate16/09/2019
dc.source.conferencelocationPisa Italy
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record