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dc.contributor.authorContino, Antonino
dc.contributor.authorCiofi, Ivan
dc.contributor.authorBaert, Rogier
dc.contributor.authorWu, Xiangyu
dc.contributor.authorAsselberghs, Inge
dc.contributor.authorCelano, Umberto
dc.contributor.authorWilson, Chris
dc.contributor.authorTokei, Zsolt
dc.contributor.authorGroeseneken, Guido
dc.contributor.authorSoree, Bart
dc.date.accessioned2021-10-27T08:10:00Z
dc.date.available2021-10-27T08:10:00Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32740
dc.sourceIIOimport
dc.titleCircuit delay and power benchmark of graphene against Cu interconnects
dc.typeProceedings paper
dc.contributor.imecauthorContino, Antonino
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorBaert, Rogier
dc.contributor.imecauthorWu, Xiangyu
dc.contributor.imecauthorAsselberghs, Inge
dc.contributor.imecauthorCelano, Umberto
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.imecauthorSoree, Bart
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecCelano, Umberto::0000-0002-2856-3847
dc.contributor.orcidimecGroeseneken, Guido::0000-0003-3763-2098
dc.contributor.orcidimecSoree, Bart::0000-0002-4157-1956
dc.source.peerreviewyes
dc.source.beginpage3.3
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019)
dc.source.conferencedate3/06/2019
dc.source.conferencelocationBrussels Belgium
dc.identifier.urlhttps://iitc-conference.org/2019-iitc-mam-program/
imec.availabilityPublished - imec


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