Show simple item record

Stress in electrochemically deposited copper

dc.contributor.authorBrongersma, Sywert
dc.contributor.authorRichard, Emmanuel
dc.contributor.authorVervoort, Iwan
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-06T10:46:18Z
dc.date.available2021-10-06T10:46:18Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3279
dc.sourceIIOimport
dc.titleStress in electrochemically deposited copper
dc.typeProceedings paper
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage249
dc.source.endpage254
dc.source.conferenceStress Induced Phenomena in Metallization: 5th International Workshop
dc.source.conferencedate23/06/1999
dc.source.conferencelocationStuttgart Germany
imec.availabilityPublished - open access
imec.internalnotesAIP Conference Proceedings; Vol. 491


Files in this item

Thumbnail
Name:
3241.pdf
Size:
317.0Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record