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Use of a thermally degradable chemical vapor deposited polymer film for low damage plasma processing of highly porous dielectrics

dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorYamaguchi, Tatsuya
dc.contributor.authorFujikawa, Makoto
dc.contributor.authorRezvanov, Askar
dc.contributor.authorChanson, Romain
dc.contributor.authorZhang, Jianran
dc.contributor.authorBabaei Gavan, Khashayar
dc.contributor.authorEl Otell, Ziad
dc.contributor.authorNozawa, S.
dc.contributor.authorKikuchi, Y.
dc.contributor.authorMaekawa, Kaoru
dc.date.accessioned2021-10-27T08:26:08Z
dc.date.available2021-10-27T08:26:08Z
dc.date.issued2019
dc.identifier.issn2637-6113
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32807
dc.sourceIIOimport
dc.titleUse of a thermally degradable chemical vapor deposited polymer film for low damage plasma processing of highly porous dielectrics
dc.typeJournal article
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorBabaei Gavan, Khashayar
dc.contributor.imecauthorEl Otell, Ziad
dc.source.peerreviewyes
dc.source.beginpage2602
dc.source.endpage2611
dc.source.journalACS Applied Electronic Materials
dc.source.issue12
dc.source.volume1
dc.identifier.urlhttps://doi.org/10.1021/acsaelm.9b00589
imec.availabilityPublished - imec


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