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dc.contributor.authorDecoster, Stefan
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorVangoidsenhoven, Diziana
dc.contributor.authorBlanco, Victor
dc.contributor.authorTamaddon, Amir-Hossein
dc.contributor.authorKesters, Els
dc.contributor.authorLorant, Christophe
dc.date.accessioned2021-10-27T08:38:14Z
dc.date.available2021-10-27T08:38:14Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32852
dc.sourceIIOimport
dc.titleExploration of EUV-based self-aligned multipatterning (SAMP) options targeting pitches below 20 nm
dc.typeProceedings paper
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorVangoidsenhoven, Diziana
dc.contributor.imecauthorBlanco, Victor
dc.contributor.imecauthorTamaddon, Amir-Hossein
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLorant, Christophe
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecTamaddon, Amir-Hossein::0000-0003-4566-0697
dc.contributor.orcidimecLorant, Christophe::0000-0001-7363-9348
dc.source.peerreviewyes
dc.source.beginpage109600L
dc.source.conferenceAdvances in Patterning Materials and Processes XXXVI
dc.source.conferencedate24/02/2019
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttps://doi.org/10.1117/12.2515173
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 10960


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