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New approach to apply 1,2,3-benzotriazole as a capping layer on UBMs for 3D TCB stacking and investigation of oxidation protection and solder wetting

dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorShehzad, Adil
dc.contributor.authorWunderle, Benhard
dc.contributor.authorHou, Lin
dc.contributor.authorSuhard, Samuel
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T08:44:37Z
dc.date.available2021-10-27T08:44:37Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32874
dc.sourceIIOimport
dc.titleNew approach to apply 1,2,3-benzotriazole as a capping layer on UBMs for 3D TCB stacking and investigation of oxidation protection and solder wetting
dc.typeOral presentation
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conference22nd EMPC2019 Electronic Packaging conference
dc.source.conferencedate16/09/2019
dc.source.conferencelocationPisa Italy
dc.identifier.urlhttp://www.empc2019.org/program/overview.html
imec.availabilityPublished - imec


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