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The influence of the bumping height on the performance of flip-chipped microwave circuits, application to coplanar Lange couplers

dc.contributor.authorCarchon, Geert
dc.contributor.authorBrebels, Steven
dc.contributor.authorPieters, Philip
dc.contributor.authorVaesen, Kristof
dc.contributor.authorVandenberghe, S.
dc.contributor.authorSchreurs, Dominique
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorNauwelaers, Bart
dc.date.accessioned2021-10-06T10:47:12Z
dc.date.available2021-10-06T10:47:12Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3288
dc.sourceIIOimport
dc.titleThe influence of the bumping height on the performance of flip-chipped microwave circuits, application to coplanar Lange couplers
dc.typeProceedings paper
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorSchreurs, Dominique
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage755
dc.source.endpage758
dc.source.conferenceInternational Symposium on Recent Advances in Microwave Technology - ISRAMT
dc.source.conferencedate13/12/1999
dc.source.conferencelocationMalaga Spain
imec.availabilityPublished - open access


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