Authors

Goel, Sandeep K.; Adham, Saman; Wang, Min-Jer; Lee, Frank; Chickermane, Vivek; Keller, Brion; Valind, Thomas; Marinissen, Erik Jan

Book

Handbook of 3D Integration - Volume 4: 3D Design, Test, and Thermal Management

Title

Test and debug strategy for TSMC CoWoS stacking process-based heterogeneous 3D-IC: A silicon study

Publication type

Book chapter