dc.contributor.author | Harada, Ken | |
dc.contributor.author | Philipsen, Harold | |
dc.contributor.author | Teugels, Lieve | |
dc.contributor.author | Struyf, Herbert | |
dc.date.accessioned | 2021-10-27T10:04:06Z | |
dc.date.available | 2021-10-27T10:04:06Z | |
dc.date.issued | 2019 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/33098 | |
dc.source | IIOimport | |
dc.title | Investigation of chemical mechanical planarization (CMP) and post-CMP cleanig for Molybdenum | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Harada, Ken | |
dc.contributor.imecauthor | Philipsen, Harold | |
dc.contributor.imecauthor | Teugels, Lieve | |
dc.contributor.imecauthor | Struyf, Herbert | |
dc.contributor.orcidimec | Philipsen, Harold::0000-0002-5029-1104 | |
dc.contributor.orcidimec | Teugels, Lieve::0000-0002-6613-9414 | |
dc.source.peerreview | no | |
dc.source.conference | International Interconnect Technology Confference 2019 (IITC/MAM) | |
dc.source.conferencedate | 3/06/2019 | |
dc.source.conferencelocation | Brussels Belgium | |
imec.availability | Published - imec | |