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Influence of pre and post process conditions on the composition of thin Si3Ni4 thin films (3nm) studied by XPS and TOFSIMS

dc.contributor.authorConard, Thierry
dc.contributor.authorDe Witte, Hilde
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorHoussa, Michel
dc.contributor.authorHeyns, Marc
dc.contributor.authorPomarede, C.
dc.contributor.authorWerkhoven, Chris
dc.date.accessioned2021-10-06T10:49:46Z
dc.date.available2021-10-06T10:49:46Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3312
dc.sourceIIOimport
dc.titleInfluence of pre and post process conditions on the composition of thin Si3Ni4 thin films (3nm) studied by XPS and TOFSIMS
dc.typeOral presentation
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorHoussa, Michel
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecHoussa, Michel::0000-0003-1844-3515
dc.source.peerreviewno
dc.source.conferenceMaterials Research Society Fall Meeting; October 1999; Boston, MA, USA.
imec.availabilityPublished - imec


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