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Study of the effect of grain boundary diffusion and Sn grain size on IMC morphology in solid state inter-diffusion soldering
Publication:
Study of the effect of grain boundary diffusion and Sn grain size on IMC morphology in solid state inter-diffusion soldering
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Date
2019
Journal article
https://doi.org/10.1038/s41598-019-51179-9
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Hou, Lin
;
Moelans, Nele
;
Derakhshandeh, Jaber
;
De Wolf, Ingrid
;
Beyne, Eric
Journal
Scientific Reports
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2012
since deposited on 2021-10-27
Acq. date: 2025-12-12
Citations
Metrics
Views
2012
since deposited on 2021-10-27
Acq. date: 2025-12-12
Citations