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Study of the effect of grain boundary diffusion and Sn grain size on IMC morphology in solid state inter-diffusion soldering
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Authors
Hou, Lin
;
Moelans, Nele
;
Derakhshandeh, Jaber
;
De Wolf, Ingrid
;
Beyne, Eric
DOI
10.1038/s41598-019-51179-9
ISSN
2045-2322
Journal
Scientific Reports
Volume
9
Title
Study of the effect of grain boundary diffusion and Sn grain size on IMC morphology in solid state inter-diffusion soldering
Publication type
Journal article
Embargo date
9999-12-31
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