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Study of the effect of grain boundary diffusion and Sn grain size on IMC morphology in solid state inter-diffusion soldering

dc.contributor.authorHou, Lin
dc.contributor.authorMoelans, Nele
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T10:32:31Z
dc.date.available2021-10-27T10:32:31Z
dc.date.issued2019
dc.identifier.issn2045-2322
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33168
dc.sourceIIOimport
dc.titleStudy of the effect of grain boundary diffusion and Sn grain size on IMC morphology in solid state inter-diffusion soldering
dc.typeJournal article
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.identifier.doi10.1038/s41598-019-51179-9
dc.source.peerreviewyes
dc.source.beginpage14862
dc.source.journalScientific Reports
dc.source.volume9
imec.availabilityPublished - open access


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