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Influence of composition of SiCN as interfacial layer on plasma activated direct bonding

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPeng, Lan
dc.contributor.authorIacovo, Serena
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorMeersschaut, Johan
dc.contributor.authorDara, Praveen
dc.contributor.authorSleeckx, Erik
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T10:44:46Z
dc.date.available2021-10-27T10:44:46Z
dc.date.issued2019
dc.identifier.issn2162-8769
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33196
dc.sourceIIOimport
dc.titleInfluence of composition of SiCN as interfacial layer on plasma activated direct bonding
dc.typeJournal article
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorMeersschaut, Johan
dc.contributor.imecauthorDara, Praveen
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecMeersschaut, Johan::0000-0003-2467-1784
dc.contributor.orcidimecDara, Praveen::0000-0002-2334-3976
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.identifier.doi10.1149/2.0241906jss
dc.source.peerreviewyes
dc.source.beginpageP346
dc.source.endpageP350
dc.source.journalECS Journal of Solid State Science and Technology
dc.source.issue6
dc.source.volume8
imec.availabilityPublished - open access


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