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Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing

dc.contributor.authorJacobs, Kristof J.P.
dc.contributor.authorLi, Yunlong
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T10:49:09Z
dc.date.available2021-10-27T10:49:09Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33206
dc.sourceIIOimport
dc.titleLocalization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing
dc.typeProceedings paper
dc.contributor.imecauthorJacobs, Kristof J.P.
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecJacobs, Kristof J.P.::0000-0002-1081-3633
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conferenceInternational Symposium for Testing and Failure Analysis (ISTFA2019)
dc.source.conferencedate10/11/2019
dc.source.conferencelocationPortland, OR USA
dc.identifier.urlhttps://asm.confex.com/asm/istfa19/webprogram/Paper48350.html
imec.availabilityPublished - imec


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