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Functional water solutions to enable wet cleaning process for leading edge semiconductor device manufacturing

dc.contributor.authorKesters, Els
dc.contributor.authorHideaki, Iino
dc.contributor.authorYuichi, Ogawa
dc.contributor.authorOniki, Yusuke
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorHolsteyns, Frank
dc.date.accessioned2021-10-27T11:16:03Z
dc.date.available2021-10-27T11:16:03Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33267
dc.sourceIIOimport
dc.titleFunctional water solutions to enable wet cleaning process for leading edge semiconductor device manufacturing
dc.typeMeeting abstract
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorHideaki, Iino
dc.contributor.imecauthorOniki, Yusuke
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecOniki, Yusuke::0000-0002-6619-1327
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.source.peerreviewno
dc.source.conferenceThe Surface Preparation and Cleaning Conference (SPCC) 2019
dc.source.conferencedate1/04/2019
dc.source.conferencelocationPortland US
imec.availabilityPublished - imec


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